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Silicon Carbide (SiC) Polishing Service Seikoh Giken now provides polishing service for silicon carbide wafers which are expected to be the next generation semi-conductor material. With a surface finish of Ra 0.1 nm and smaller in utilizing our technology, the wafer surface becomes immediately ready for the epitaxial growth. Re-claim polishing for epitaxial used wafers is also available. Applicable wafer size varies from 2 inch to 6 inch. For more information on our products, please click here.

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