Heat Dissipation (Heat Sink Block)

High Effeciency Dissipation for temparature cotrol

Background

• ・Today the trend in the world faces that it is important to effeciently dissipate heat inside package for optical module and optical transceiver are required high performance, high capability, and compact.
• ・Our Heat Sink Block (Heat Dissipation) can achieve to effeciently conduct the generated heat to cooling system by mount on between semi-conductor and laser.

Feature

• ・Our CuW that has both Cu(High Thermal Conductivity) and W(Low Thermal Expansion) is avaiable to manufacture the complex shape and machinability.
• ・And our S-CMC (Cu/Mo multi-layer) has high dessipation.
• ・We are flexible to make the sample and product using various heat dissipation material (ALN, KOVAR etc) to meet your target price and requirement.

Market/Application

• LD module (TO-CAN, Transceiver etc...) for communication, The laser for Inductory and Medical etc...

Please contact us if you have any questions for specifications and other details.

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